Your Shopping Cart is empty.
  • Total:


Download sample
File Details
Published: 2024-01-23 22:59:01.588849 Category: Industry Type: Illustration Model release: No
Share
       

Silicon Die are being Extracted from Semiconductor Wafer and Attached to Substrate by Pick and Place Machine. Computer Chip Manufacturing at Fab. Semiconductor Packaging Process, generative ai

Contributor: Krisana
ID : 717197939
TitleFilesize
Illustration5333x8000


Buy on Adobe Stock
Keywords
circuit, component, computer, microchip, processor, technology, transistor, controller, development, device, fabrication, facility, factory, foundry, industrial, industry, integrated, machine, manufacturing, package, process, production, research, science, semiconductor, silicon, disc, nanotechnology, memory, die, electronic, shortage, arm, advanced, robotic, chips, central processing unit, cardboard box, constructed, neon, electrical, hardware, motherboard, business, engineering, music, part, sound


Related items